2.5D & 3D Semiconductor Packaging Market Report
The Global 2.5D & 3D Semiconductor Packaging Market is segmented by Packaging Technology (3D Wafer-Level Chip-Scale Packaging (WLCSP), 3D TSV, 2.5D), End-User Industry (Consumer Electronics, Aerospace, and defense, Medical Devices, Communications and Telecom, Automotive) and region (North America, Europe, Asia-Pacific, Middle East, and Africa and South America).
The global 2.5D & 3D Semiconductor Packaging Market size is projected to reach a CAGR of 17.7% from 2023-2030.
2.5D/3D are packing methodologies for including numerous IC inside the same package. In a 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer to achieve significantly high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for the shortest interconnect and smallest package footprint.
The growth of the market is attributed to the growing consumption of semiconductor devices across several industries. Additionally, increasing demand for compact, high-functionality electronic devices is also going to drive the market. Furthermore, the growing adoption of high-end computing, servers, and data centers is going to provide the market with new opportunities.
On the other hand, high initial investment and increasing complexity of semiconductor IC designs is the major restraining factor for the market.
A pandemic like COVID-19 is anticipated to fuel the manufacturing of advanced medical devices and equipment to tackle such crises in the future. For instance, in 2021, GE Healthcare announced that it would increase its manufacturing capacity for medical equipment, including CTs, ultrasound devices, mobile X-ray systems, patient monitors, and ventilators, to cater to the ongoing challenge of treating COVID-19 patients. Since 2.5D & 3D Semiconductor Packaging has numerous applications in the medical industry, the proliferation of medical equipment manufacturing is expected to drive market growth.
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Last Update : Jun 01, 2023 2:56 AM
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