What are SAP and mSAP in Flexible Circuit Fabrication? (Computers - Hardware)

Item ID 133464696 in Category: Computers - Hardware

What are SAP and mSAP in Flexible Circuit Fabrication?
The term "sintered silver adhesive paste" (SAP) refers to a type of conductive paste used to construct flex circuit interconnects. The composition of SAP paste includes a polymer adhesive binder and silver microparticles. SAP, in contrast to conductive inks, employs a post-print heat sintering process in which the individual silver particles adhere to an adhesive bond layer to form metal-like conductivity. Contact info:- https://www.tumblr.com/efpcb/774548649713729536/what-are-sap-and-msap-in-flexible-circuit
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Target State: All States Target City : Shenzhen Last Update : Apr 02, 2025 8:25 AM Number of Views: 41	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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2025-04-26 (0.775 sec)